CORDIS Project
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This project involves collaboration among major semiconductor companies to advance 450mm wafer processing technology. It aims to support European equipment and materials companies in adapting to this new manufacturing standard.
Five major global semiconductor companies are working in the G450C consortium based in Albany N.Y. to introduce 450mm wafer semiconductor processing and are now installing the first wave of 450mm prototype systems.
Intel and TSMC lead this effort with published roadmaps showing pilot lines in 2016, production in 2018.
Samsung will soon follow which will force GlobalFoundries, SK Hynix, Toshiba, UMC and Micron to invest in 450mm else face a steady decline.The 2012 AENEAS/Catrene paper Innovation…
ASM INTERNATIONAL N.V.
Partner organizations (coordinator is shown above), with normalized type and CORDIS activity type. Guests see up to 4 partners.
Belgium, HEVERLEE
Type: Company (for-profit)
Activity type: Private for-profit entities (excluding Higher or Secondary Education Establishments)
SME: No
Switzerland, Uster
Type: Company (for-profit)
Activity type: Private for-profit entities (excluding Higher or Secondary Education Establishments)
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