CORDIS Project
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FAB2ASM addresses the challenge of integrating miniaturized components in 3D microelectronics with high speed and precision. By combining robotic tools and self-alignment techniques, it aims to enhance the efficiency of die-level assembly, making it suitable for advanced microsystems applications.
FAB2ASM tackles a major problem in 3D integration that currently limits industrial take-up: high throughput and high accuracy 3D integration of miniaturized dies onto dies or substrates.
This issue is extremely important for 3D integration of microelectronics and microsystems. 3D integration will take off in the next 5 years in all measures including total number of devices, the market share, as well as the density of the connections.
The state-of-the-art integration technology for 3D microsyste…
AALTO KORKEAKOULUSAATIO SR
Partner organizations (coordinator is shown above), with normalized type and CORDIS activity type. Guests see up to 4 partners.
France, Besancon
Type: University / higher education
Activity type: Higher or Secondary Education Establishments
SME: No
Switzerland, Dubendorf
Type: University / higher education
Activity type: Higher or Secondary Education Establishments
SME: No
Netherlands, Enschede
Type: University / higher education
Activity type: Higher or Secondary Education Establishments
SME: No
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