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FAMEPIC focuses on improving the packaging process of Photonic Integrated Circuits (PICs) using advanced 3D-printing techniques. By integrating optical components directly onto PIC substrates, the project aims to reduce costs and fabrication time while enhancing performance for applications in data and telecommunicatio…
The wide-range deployment of Photonic Integrated Circuits (PICs) is hindered by high costs and design constraints, a large fraction of which is assigned to the packaging process. FAMEPIC will address these head-on.
Our breakthrough approach leverages the potential of volumetric grey scale lithography via Two-Photon Polymerization for 3D-print photonic connections between and to PICS.
The process enables on-the-fly alignment thanks to the fabrication of a variety of optical components directly on…
CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE CNRS
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