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The LO-KMOF project explores the use of metal-organic frameworks as dielectrics in chip interconnects to improve performance. This innovative approach aims to reduce power consumption and enhance signal speed in integrated circuits.
Since the invention of integrated circuits, there has been a persistent incentive towards miniaturization.
An indispensable part of every chip is a multi-level wiring system fabricated on top of the semiconductor layer containing the transistors.
As transistors get smaller and more densely packed, the complexity and the impact on performance of the on-chip interconnects rises.
The non-zero resistance and capacitance associated with the metal wires and the dielectric medium between them induce cr…
KATHOLIEKE UNIVERSITEIT LEUVEN
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