CORDIS Project
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This project develops a novel platform for integrating microelectronic circuits with micro and nano-electromechanical systems. It aims to create highly compact and efficient systems for various applications, including sensors and low-power electronics.
Within the ERC-M&M´s Starting Grant project (No.277879) we are exploring an innovative platform technology for wafer-level heterogeneous integration of integrated circuits (ICs) with micro/nano-electromechanical systems (MEMS/NEMS).
This type of heterogeneous 3D integration technology is part of the More-than-Moore paradigm depicted in the International Technology Roadmap for Semiconductors (ITRS) and allows the combination of standard CMOS-based integrated circuits and high-performance MEMS de…
KUNGLIGA TEKNISKA HOEGSKOLAN
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