CORDIS Project
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The project aims to create innovative packaging solutions for semiconductors that enhance reliability and thermal performance. By using advanced manufacturing techniques, it seeks to eliminate traditional wire bonds and improve the durability of components used in aerospace applications.
The objective of this proposal is to develop double side cooled packaging solutions for semiconductors eliminating the use of inherently unreliable aluminium wire bonds and replacing with seamless contacting techniques to either side of the active semiconductor thereby providing a very reliable low thermal resistance,low inductance contact .
The solutions developed using innovative additive laser machining and lost wax techniques will be applicable to not only todays active components but tomorr…
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United Kingdom, LINCOLN
Type: Company (for-profit)
Activity type: Private for-profit entities (excluding Higher or Secondary Education Establishments)
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