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The MEMPACK project focuses on developing advanced packaging solutions for radio frequency micro-electromechanical systems (RF-MEMS) to enhance their integration in communication technologies. It aims to address critical issues in design, technology, and reliability, facilitating the commercialization of high-performan…
Future personal and ground RF communications systems and communications satellites necessitate the use of highly integrated RF front-ends, featuring small size, low weight, high performance and low cost.
Off-chip, bulky passive RF components, like discrete PIN diode switches and ceramic filters, are limiting further chip scaling. MEMS technology is now rapidly emerging as an enabling technology to yield a new generation of high-performance RF-MEMS passives, like switches, high-Q resonators and t…
INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM
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