CORDIS Project
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The project focuses on enhancing semiconductor and power electronics performance through improved thermal management and integration technologies. It explores new materials and methods to reduce thermal resistance and increase efficiency in applications like hybrid vehicles.
One of the major limitations to continued performance increases in the semiconductor and power electronics industries is integration density and thermal management.
Continued transistor downscaling is quickly reaching its limits forcing a new focus on heterogeneous integration and 3D packaging technologies to continue performance improvements by reducing interconnect length between memory and multi-core logic.
These efforts must combine high density electrical interconnects with low resistance t…
Partner organizations (coordinator is shown above), with normalized type and CORDIS activity type. Guests see up to 4 partners.
Austria, KLOSTERNEUBURG
Type: Company (for-profit)
Activity type: Private for-profit entities (excluding Higher or Secondary Education Establishments)
Switzerland, Rueschlikon
Type: Company (for-profit)
Activity type: Private for-profit entities (excluding Higher or Secondary Education Establishments)
SME: No
Germany, ESCHENBACH
Type: Company (for-profit)
Activity type: Private for-profit entities (excluding Higher or Secondary Education Establishments)
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