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NanoWelds is a novel 3D integration technology that uses nanowires to bond surfaces at room temperature without additives. This method aims to revolutionize the electronic packaging industry by enabling smaller, cost-effective devices while eliminating the need for high-temperature soldering and toxic metals.
The electronic packaging industry, with revenues estimated at €1.2 billion for 2020, is currently stuck mostly due to the fact that the triad performance, form-factor and cost has reached its limit.
Key sectors such as the semiconductor and e-mobility industry are claiming for the development and implementation of new integration technologies able to fulfil their current needs in line with decreasing device size, cost-effectiveness, and efficient packaging.
At NanoWired GmbH, a German company re…
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