CORDIS Project
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The project aims to enhance the design and manufacturing process of System in Package (SiP) technology, making it easier for small and medium-sized enterprises to create advanced, miniaturized products. It focuses on improving design methodologies to optimize performance and reduce costs.
Integration of heterogeneous systems in a package (SiP) allows smaller, smarter and more energy efficient products for many applications.
Through SiPs, even small or medium-sized enterprises could gain access to the development of technologically advanced, miniaturized products.
However, to date, the lack of appropriate design methodologies and flows hinders the efficient development of SiPs. PARSIMO aims at enabling first time right design of heterogeneous SiP, which can contain sensors, MEMS,…
Partner organizations (coordinator is shown above), with normalized type and CORDIS activity type. Guests see up to 4 partners.
France, Amiens
Type: University / higher education
Activity type: Higher or Secondary Education Establishments
SME: No
France, Caen
Type: University / higher education
Activity type: Higher or Secondary Education Establishments
SME: No
Poland, Wroclaw
Type: University / higher education
Activity type: Higher or Secondary Education Establishments
SME: No
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