CORDIS Project
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This project focuses on improving wafer inspection in semiconductor manufacturing by analyzing microcracks and slip bands using X-ray Diffraction Imaging. The goal is to enhance predictive capabilities regarding defects that could lead to yield loss and wafer breakage, thereby benefiting European wafer manufacturers.
Wafer handling in semiconductor manufacturing introduces microcracks at the wafer edge.
During thermal processing, some of these grow into slip bands; on rapid thermal processing some of these grow into cracks, shattering the wafer and disrupting manufacture.
Dense slip bands also lead to yield loss by locally increasing diffusion rates.
Breakage losses alone were of the order of €2.5M p.a. for a single fab line at the 90 nm node.
Microcracks and slip bands are visible through X-ray Diffraction…
Partner organizations (coordinator is shown above), with normalized type and CORDIS activity type. Guests see up to 4 partners.
Germany, Karlsruhe
Type: University / higher education
Activity type: Higher or Secondary Education Establishments
SME: No
Germany, Freiburg
Type: University / higher education
Activity type: Higher or Secondary Education Establishments
SME: No
Germany, KARLSRUHE
Type: University / higher education
Activity type: Higher or Secondary Education Establishments
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