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The THINPAC project focuses on developing ultra-thin, flexible packaging for medical implants that enhances their performance and longevity. By utilizing advanced materials and innovative fabrication techniques, it aims to create biocompatible devices suitable for neuroelectronic applications, ultimately improving pati…
Microelectronic medical implants with superior performance are needed to improve quality of life for patients.
For neuroelectronic applications, this will be enabled through miniaturisation of large numbers of high-density electrodes in bio-mimetic packages.
The leading solution is to use ultra-thin silicon chips (UTCs) embedded in flexible polymers with small flexible ribbon cables.
However, this technology creates a unique challenge of maintaining sufficient hermeticity, biocompatibility and b…
INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM
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